Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents

Copper electrodeposition on Au(111) from deep eutectic solvents (DESs) type III was investigated employing cyclic voltammetry as well chronoamperometry. It further examined Au(poly) using the electrochemical quartz crystal microbalance (EQCM). The employed DESs are mixtures of choline chloride (ChCl) or nitrate (ChNO3) with ethylene glycol (EG) hydrogen bond donor (HBD), each in a molar ratio 1 : 2. CuCl, CuCl2, Cu(NO3)2 ? 3H2O were added copper sources. Underpotential deposition (UPD) Cu precedes bulk electrolytes. Cu+ media is observed one-electron reaction, whereas Cu2+ occurs two steps since strongly stabilized by chloride. less and beginning nitrate-containing DES shifted several hundred mV to more positive potentials compared DES. A diffusion-controlled, three-dimensional nucleation growth mechanism found chronoamperometric measurements analysis based model Scharifker Mostany.